Francisco Javier Andani, Lorenzo Rubio, Bernardo Bernardo, Vicent M. Rodrigo Peñarrocha, Juan Reig, Luis Valle, Universitat Politecnica de Valencia, Spain; Herman Fernández, Universidad Pedagógica y Tecnológica de Colombia, Spain; Jesús Pérez, Rafael P. Torres, Universidad de Cantabria, Spain

Kenya Shimizu, Takayuki Nakanishi, Michio Takikawa, Yoshio Inasawa, Mitsubishi Electric Corporation, Japan

Shiqi Wang, Siyi Huang, Haochang Wu, Hao Qin, Xingqi Zhang, University College Dublin, Ireland

Melissa Eugenia Diago Mosquera, Alejandro Aragón Zavala, Tecnologico de Monterrey, Mexico; Mauricio Rodriguez, Pontificia Universidad Católica de Valparaíso, Chile

Jingzhe Wang, Siyu Lin, School of Electronic and Information Engineering, Beijing Jiaotong University, Beijing 100044, China, China; Yuanxuan Li, Locomotive and Car Research Institute, China Academy of Railway Science, Beijing 100081, China, China

Hao Qin, Xingqi Zhang, University College Dublin, Ireland; Weibin Hou, Jiadong Du, China Academy of Information and Communications Technology, China; Shunchuan Yang, Beihang University, China

Saranraj Karuppuswami, Smit Baua, Altair Engineering, Inc., United States

Rubén F. M. Delgado Castillo, Mirhamed Mirmozafari, Nader Behdad, University of Wisconsin-Madison, United States

Yuxuan Li, Lei Zheng, Han Wang, Hai Lin, State Key Laboratory of CAD&CG, Zhejiang University, China

Ryotaro Taniguchi, Tomoki Murakami, Minoru Inomata, Tomoaki Ogawa, Yasushi Takatori, Nippon Telegraph and Telephone Corporation, Japan