WE-UE.1A.1: Using the Equivalent Circuit Approach for Modeling the Electromagnetic Coupling to Multilayer PCB Traces
Mohamed Hamdalla, Somen Baidya, Ahmed Hassan, University of Missouri-Kansas City, United States; Daryl Beetner, Victor Khilkevich, Missouri University of Science and Technology Rolla, United States; John McGeehan, BAE Systems – FASTLabsTM, United States; Anthony Caruso, Missouri Institute for Defense & Energy (MIDE), United States
WE-UE.1A.2: On the Use of a Microstrip Meander Line to Reduce Mutual Coupling between a Patch Antenna and a Transmission Line on Printed Circuit Boards
Tania Islam, Tasin Nusrat, Sayan Roy, South Dakota Mines, United States
WE-UE.1A.5: A 2x-Thru Standard De-embedding Method of Surface Components in High-Speed PCBs
Jian-Yao Ye, Jun Fan, Xin Cao, Qiang-Ming Cai, Yuyu Zhu, Yuying Zhu, Southwest University of Science and Technology, China
WE-UE.1A.6: Devices and Experiments for Exploring RF Breakdown in Micrometer-Scale Air Gaps
Christopher Nordquist, Alexander Ruyack, Matthew Jordan, Chris Moore, Gwendolyn Hummel, Sergio Herrera, Adrian Schiess, Sandia National Laboratories, United States; Andrew Bingham, Akima Infrastructure Services, United States; Zach Vander Missen, Steven Pugia, Alden Fisher, Dimitrios Peroulis, Purdue University, United States
WE-UE.1A.7: Using Black-Box Macromodeling of Multiport Microwave Components for Electromagnetic Simulations
Richard Hunt, Mohamed Hamdalla, Ahmed Hassan, University of Missouri-Kansas City, United States; Joshua Harp, Anthony Caruso, Missouri Institute for Defense & Energy (MIDE), United States; Daryl Beetner, Victor Khilkevich, Missouri University of Science and Technology Rolla, United States; John McGeehan, BAE Systems – FASTLabsTM, United States
